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IPC FC-234A
Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards
Organization:
IPC - Association Connecting Electronics Industries
Year: 2014
Abstract: This document provides guidelines for the use of PSAs in single or double sided flexible printed circuits (see Figures A2 through A8), membrane switches (see Figures A9 through A12) and component attachments (see Figures A1 and A13). In addition, the guideline describes the type of materials and processes that may be used to accomplish proper assemblies.
Purpose
This document is intended as a guide to the user by seeking answers to questions related to accepted, effective methods for the use of PSAs in FPC assemblies. The methods described herein are not specifications. PSA technology is continuously evolving such that applications and requirements may vary beyond the scope of this publication.
Purpose
This document is intended as a guide to the user by seeking answers to questions related to accepted, effective methods for the use of PSAs in FPC assemblies. The methods described herein are not specifications. PSA technology is continuously evolving such that applications and requirements may vary beyond the scope of this publication.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T18:18:25Z | |
| date available | 2017-09-04T18:18:25Z | |
| date copyright | 2014.11.01 | |
| date issued | 2014 | |
| identifier other | HRLQJFAAAAAAAAAA.pdf | |
| identifier uri | https://lib.yabesh.ir/std/handle/yse/201155 | |
| description abstract | This document provides guidelines for the use of PSAs in single or double sided flexible printed circuits (see Figures A2 through A8), membrane switches (see Figures A9 through A12) and component attachments (see Figures A1 and A13). In addition, the guideline describes the type of materials and processes that may be used to accomplish proper assemblies. Purpose This document is intended as a guide to the user by seeking answers to questions related to accepted, effective methods for the use of PSAs in FPC assemblies. The methods described herein are not specifications. PSA technology is continuously evolving such that applications and requirements may vary beyond the scope of this publication. | |
| language | English | |
| title | IPC FC-234A | num |
| title | Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards | en |
| type | standard | |
| page | 36 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2014 | |
| contenttype | fulltext |