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IPC TR-578
Leading Edge Manufacturing Technology Report Results of a Round Robin Study on Minimum Conductor Width and Plated-Through Holes in Rigid, Bare Copper, Double Sided Printed Wiring Boards
Organization:
IPC - Association Connecting Electronics Industries
Year: 1984
Abstract: OBJECTIVE
The "Program For Round Robin Evaluation of High Density, Double-Sided Copper Only (fine line, small plated-through hole) Printed Wiring Boards" has the following objectives:
The "Program For Round Robin Evaluation of High Density, Double-Sided Copper Only (fine line, small plated-through hole) Printed Wiring Boards" has the following objectives:
- To evaluate the state-of-the-art in the international printed wiring board industry for fabrication of high density, double sided, rigid bare copper boards.
- Collect data on different manufacturing methods and substrates used to fabricate printed wiring boards.
- Include all recognized printed wiring board manufacturing methods: i.e., subtractive, thin foil, semi-additive and fully-additive.
- Determine the reliability and quality of the boards producedu sing recognized industry testing practices and procedures.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T18:27:39Z | |
| date available | 2017-09-04T18:27:39Z | |
| date copyright | 09/01/1984 | |
| date issued | 1984 | |
| identifier other | IONVCAAAAAAAAAAA.pdf | |
| identifier uri | https://lib.yabesh.ir/std/handle/yse/209838 | |
| description abstract | OBJECTIVE The "Program For Round Robin Evaluation of High Density, Double-Sided Copper Only (fine line, small plated-through hole) Printed Wiring Boards" has the following objectives:
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| language | English | |
| title | IPC TR-578 | num |
| title | Leading Edge Manufacturing Technology Report Results of a Round Robin Study on Minimum Conductor Width and Plated-Through Holes in Rigid, Bare Copper, Double Sided Printed Wiring Boards | en |
| type | standard | |
| page | 100 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1984 | |
| contenttype | fulltext |