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IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 441-460 of 793
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IPC TR-585
Abstract: PURPOSE
The purpose of this investigation is to identify a stress test that will distinguish between robust and non-robust finishes. A robust finish will pass a test for solderability, and a non robust ... -
IPC TM-650 2.4.42.2
Abstract: The purpose of this test is to determine the integrity of materials and procedures used to attach semiconductor die or surface mounted elements to package headers or other substrates. This determination is based on a measure ... -
IPC TM-650 2.6.8.1
Abstract: To determine the resistance of the laminate to thermal stress in both the etched and unetched state. -
IPC 6011 GERMAN
Abstract: Diese Spezifikation legt die allgemeinen Anforderungen an Leiterplatten sowie die Anforderungen an die Qualitätsund Zuverlässigkeitssicherung fest, die für ihre Beschaffung eingehalten werden müssen. ... -
IPC TM-650 2.2.7A
Abstract: To measure the inside diameter of plated through holes in printed wiring boards. -
IPC A-610E DANISH
Abstract: Denne standard er en samling af visuelle kvalitets godkendelseskrav for elektronikprodukter. Denne standard angiver godkendelseskrav i forbindelse med produktion af elektriske og elektroniske produkter. Historisk set har ... -
IPC D-310C
Abstract: Scope:Scope and Purpose
This publication defines guidelines for the design and production of phototools used in the production of printed ...
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IPC TM-650 2.5.4
Abstract: This test method is to determine allowable current load for conductors. -
IPC TM-650 2.1.8B
Abstract: This method describes the procedure required to examine materials and/or finished product for workmanship, which is the general quality of the goods other than as specified by the applicable standard. -
IPC 7526
Abstract: This Handbook addresses the removal of solder paste and uncured/unreacted SMT adhesives from stencils, misprinted printed circuit boards (PCBs) and application tools connected to the soldering paste application processes. ... -
IPC DW-425A
Abstract: Scope:This standard covers design and end product requirements of discrete wiring boards which utilize discrete wires to interconnect termination areas on or within flexible ...
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IPC TM-650 1.9A
Abstract: Tests performed on presumably identical samples under seemingly identical conditions do not always yield identical results. This is due in part to errors inherent in every measurement. During the development of a new test ... -
IPC D-355
Abstract: This standard is used to describe the relationship between components (electronic, electro-mechanical, and mechanical) and the printed boards used as the major form of interconnection. Included in these descriptions are ... -
IPC TM-650 1.1C
Abstract: Introduction
This manual establishes uniform methods for testing electronic and electrical parts including basic environmental, physical and electrical tests. These tests were developed to support IPC ... -
IPC 2221B
Abstract: This standard establishes the generic requirements for the design of organic printed boards and other forms of component mounting or interconnecting structures, including PC card form factors. The organic materials may be ...