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IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 421-440 of 793
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IPC TM-650 2.4.27.2A
Abstract: This method is designed to evaluate the hardness of solder masked surfaces and its resistance to abrasion. -
IPC TM-650 2.5.5.8
Abstract: This test method establishes a procedure for determining the low frequency out of plane dielectric constant and loss tangent of organic free films using a two-fluid method. (Low frequency is defined as less than or equal ... -
IPC TM-650 2.4.46A
Abstract: This test method will give an indication of activity of wave solder fluxes, core solder fluxes, and solder paste. -
IPC J-STD-006B CHINESE
Abstract: This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, and powder solders, for electronic soldering applications; and for ... -
IPC FC-234
Abstract: This document provides guidelines for the use of PSA's in single or double sided flexible printed circuits (see figures 3, 4, 5, 6, 7, 8, 9), membrane switches (see figures 10, 11, 12, 13) and component attachments (see ... -
IPC TM-650 2.4.8C
Abstract: This test method is designed to determine the peel strength of metallic cladding when tested in the following conditions, "as received," after thermal stress, and after exposure to processing chemicals; and to evaluate the ... -
IPC FA-251
Abstract: This document provides guidelines for the assembly of components and mounting hardware to single-and double-sided flexible printed wiring. In addition, the guidelines describe the type of materials and processes that may ... -
IPC 4103A
Abstract: This specification covers the requirements for high speed/high frequency performance plastic substrates to be used for fabrication of printed boards for microstrip, stripline, and high speed digital electrical and electronic ... -
IPC C-406
Abstract: With the present packaging trend in system design moving towards compact, low-power consumption configurations, the use of Surface Mount Technology offers a viable approach toward achieving the desired packaging goals. ... -
IPC 4110
Abstract: This specification covers paper made from cellulosic fibers intended as a reinforcing material in laminated plastics for electrical and electronic use.
Purpose This specification determines the ... -
IPC TM-650 2.6.15C
Abstract: This test method is designed to determine the corrosive properties of flux residues under extreme environmental conditions. A pellet of solder is melted in contact with the test flux on a sheet metal test piece. The solder ... -
IPC TM-650 2.3.27
Abstract: To quantify the residual rosin left from solder paste and/or wave soldering flux after the reflow and cleaning process. -
IPC CC-830B
Abstract: This standard establishes qualification and conformance requirements for electrical insulating compounds (conformal coatings). It has been designed and constructed with the intent of obtaining maximum confidence in the ... -
IPC TM-650 2.3.24.1
Abstract: This test method provides a procedure for testing the porosity of gold electroplated from an alkaline (cyanide), acid, or neutral gold plating solution on a nickel substrate in contact with the gold deposit. -
IPC TM-650 2.2.12.3
Abstract: This method of test covers the procedure for determining the weights and/or thickness of etchable carrier copper foils for printed circuits. -
IPC 7711B/7721B SWEDISH
Abstract: Detta dokument omfattar olika förfaranden för reparation och omarbetning av kretskort och är en sammanställning av information som samlats in, införlivats och sammansatts av arbetsgruppen för ... -
IPC D-326A
Abstract: This document covers the information requirements for the procurement of material, box build, assembly, system integration, inspection, test, burn-in, and delivery and/or distribution of electronic assemblies.