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IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 401-420 of 793
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IPC TM-650 2.5.28A
Abstract: This test method defines the procedure for determining the Q resonance of copper foil clad, rigid, and flexible dielectric material. -
IPC J-STD-003C
Abstract: This standard prescribes test methods, defect definitions, and illustrations for assessing the solderability of printed wiring board surface conductors, attachment lands, and plated-through holes. This standard is intended ... -
IPC 9850A
Abstract: This standard establishes the procedures to characterize the capability of surface mount assembly equipment in specification documents, as well as in documentation used to verify a specific machine's placement capability ... -
IPC TM-650 2.5.7.1
Abstract: The dielectric withstanding voltage test (also called high-potential, over potential or voltage breakdown test) consists of the application of a voltage higher than rated voltage for a specific time between mutually isolated ... -
IPC TM-650 2.5.7D
Abstract: The dielectric withstanding voltage test (also called high-potential, over potential, voltage breakdown, or dielectric strength test) consists of the application of a voltage higher than rated voltage for a specific time ... -
IPC 2611
Abstract: This standard establishes the generic requirements for a document set describing electronic products, and the methodology used for revision control and configuration management of the information. The generic descriptions ... -
IPC TM-650 2.5.7.2A
Abstract: The dielectric withstanding voltage test (Hipot test) consists of the application of a voltage higher than the operating voltage for a specific time across the thickness of the test specimen's dielectric layer. This is ... -
IPC 7094
Abstract: This document describes the design and assembly challenges for implementing flip chip technology in a direct chip attach (DCA) assembly. The effect of bare die or die size components in a flip chip format has an impact on ... -
IPC 2512A
Abstract: This standard is part of the IPC-2510 series of standards. These standards are used to specify a data file format used to describe printed board and printed board assembly products with details sufficient for tooling, ... -
IPC TM-650 2.2.18.1
Abstract: This test method is designed to determine the minimum and maximum thickness of the base material of metallic clad laminates by microsectioning and optical measurement. -
IPC TM-650 2.2.12A
Abstract: This method of test covers the procedure for determining weight (average thickness - by weight measurement) of copper foil for printed circuits. -
IPC TM-650 2.3.38C
Abstract: This test method is for use in determining if organic, nonionic contaminants are present on bare printed wiring board, and completed assembly surfaces in the production area by limited technical personnel. Although the ... -
IPC IPC/JEDEC J-STD-002D
Abstract: This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs, and tabs. ... -
IPC TM-650 2.4.8.3A
Abstract: This test is designed to determine the peel strength of the metal cladding to the base laminate while exposed to elevated temperature by means of heated air chamber; and to evaluate the base laminate material after the ...