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IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 381-400 of 793
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IPC J-STD-001F
Abstract: This standard prescribes practices and requirements for the manufacture of soldered electrical and electronic assemblies. For a more complete understanding of this document's recommendations and requirements, one may use ... -
IPC TM-650 2.3.42
Abstract: This test method is used to determine the ability of a solder mask to resist degradation by solvents and cleaning agents. -
IPC TM-650 2.4.24.5
Abstract: This test is designed to determine the glass transition temperature (Tg) and coefficient of thermal expansion (CTE) of dielectric materials used in high density interconnect (HDI) and microvias by the use of thermal ... -
IPC TM-650 2.4.44
Abstract: This test is to determine the ability of a printed pattern of solder paste to retain a probe placed in the solder paste by measuring the force required to separate the probe from the paste. Time between printing and probe ... -
IPC 7093
Abstract: This document describes the design and assembly challenges for implementing Bottom Termination surface mount Components (BTCs) whose external connections consist of metallized terminations that are an integral part of the ... -
IPC J-STD-012
Abstract: This document describes the implementation of flip chip and related chip scale semiconductor packaging technologies. The areas discussed include: design considerations, assembly processes, technology choices, application, ... -
IPC TM-650 2.3.10.1
Abstract: This test method is intended to evaluate the relative flame resistance characteristics of a permanent solder mask coating on specified printed wiring laminates. It is intended for use on laminate 0.5 mm thick and greater. ... -
IPC 6011
Abstract: Statement of Scope
This specification establishes the general requirements for printed boards and the quality and reliability assurance requirements that must be met for their acquisition. The intent ... -
IPC TM-650 2.4.26
Abstract: This test method shall establish and define the methods for predicting the bond strength, on a go-no-go basis, of additive rigid epoxy glass boards of the swelletchable type. -
IPC 6012C
Abstract: Statement of Scope This specification establishes and defines the qualification and performance requirements for the fabrication of rigid printed boards.
Purpose The purpose of this ... -
IPC J-STD-001E HUNGARIAN
Abstract: This standard prescribes practices and requirements for the manufacture of soldered electrical and electronic assemblies. Historically, electronic assembly (soldering) standards contained a more comprehensive tutorial ... -
IPC 6013B GERMAN
Abstract: Diese Spezifikation deckt die Anforderungen an die Qualifikation und Leistungsspezifikation für flexible Leiterplatten ab. Die flexible Leiterplatte kann einseitig, zweiseitig, als Multilayer oder Starrflex-Multilayer ... -
IPC TM-650 2.4.37A
Abstract: The scope of this test method is to provide a means by which hand soldering tools may be evaluated under a standard, controlled set of conditions. This method may be used to either evaluate a single tool's performance or ... -
IPC TR-476A
Abstract: This technical report discusses the reasons and the test methods available for electrically induced failures on printed wiring board surfaces and sub-surfaces caused by a combination of voltage potential, electrical field, ... -
IPC TM-650 2.4.1.3
Abstract: This test method is to determine the adhesion quality of resistive and capacitive materials on the substrate surface of finished hybrid circuits.