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IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 321-340 of 793
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IPC D-356B
Abstract: SCOPE AND OBJECTIVE
This standard describes a data format for transmitting bare board electrical test information. The material contained herein is intended to convey requirements, guidelines, and ... -
IPC A-600H SWEDISH
Abstract: This document describes the preferred, acceptable, and non-conforming conditions that are either externally or internally observable on printed boards. It represents the visual interpretation of minimum requirements set ... -
IPC TM-650 2.4.9D
Abstract: This test method defines the procedure for determining the bond strength of copper foil clad flexible dielectric material. -
IPC TM-650 2.4.24.6
Abstract: This test method establishes a procedure for determining the thermal decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA). Use of this test method for printed wiring boards or ... -
IPC TM-650 2.5.33.3
Abstract: This test method measures DC and AC current leakage from the tip of the Unit Under Test (UUT) to ground. The AC frequency range measured is in the 20 Hz to 20 MHz range, which covers the currently known equipment base. If ... -
IPC TM-650 2.4.2A
Abstract: Ductility values are determined by measuring the bulge height on a Mullen bulge tester or equivalent. Measurements are made in mm. -
IPC J-STD-001E
Abstract: This standard prescribes practices and requirements for the manufacture of soldered electrical and electronic assemblies. Historically, electronic assembly (soldering) standards contained a more comprehensive tutorial ... -
IPC IPC/EIA J-STD-026
Abstract: This standard addresses semiconductor chip design. It is intended for applications utilizing standard substrates, materials, assembly, and test methods as well as established semiconductor fabrication and bumping processes. ... -
IPC TM-650 2.2.6A
Abstract: To measure the inside diameter of drilled through-holes in printed wiring boards, either in process or end product. -
IPC 6015
Abstract: This specification establishes the specific requirements for the organic mounting structure used to interconnect chip components, which in combination form the completed functional Organic Single-chip Module (SCM-L) or ... -
IPC TM-650 2.3.31
Abstract: This test method is designed to determine relative degree of cure in liquid U.V. curable materials such as etch resists, plating resists and solder masks. It is not applicable to dry film products nor to solvent-based ... -
IPC TR-462
Abstract: The Round Robin Test Program had the following objectives. Determine the effectiveness of different protective coatings, and methods of coating application, on printed wiring boards. Coatings were to be applied over a ... -
IPC TR-579
Abstract: Objective
The "Round Robin Reliability Evaluation of Small Diameter Plated Through Holes (PTH) in Printed Wiring Boards" had the following objectives:
• Evaluate the performance of small ... -
IPC IPC/JEDEC J-STD-033C
Abstract: This standard applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices, and other moisture sensitive devices made with ... -
IPC SM-780
Abstract: This document provides guidelines for surface mounting electronic parts, and for intermixing surface and through-the-board mounting techniques. In addition, it describes the types of materials and interconnection substrates ... -
IPC J-STD-001ES
Abstract: This Addendum provides requirements to be used in addition to, and in some cases, in place of, those published in IPC J-STD-001E to ensure the reliability of soldered electrical and electronic assemblies that must survive ... -
IPC TM-650 2.4.51
Abstract: To determine dispersion of glass microbeads in Self Shimming Thermally Conductive Adhesives, thus ensuring the proper self-induced gap. It is important for the beads to be well dispersed throughout the batch, since this ... -
IPC 2615
Abstract: This Standard covers dimensioning and tolerancing of electronic packaging as it relates to printed boards and the assembly of printed boards. The concepts defined in this Standard are derived from ASME Y14.5M-1994. Printed ... -
IPC TM-650 2.4.41.1A
Abstract: To describe the vitreous silica dilatometer method for determining the linear thermal expansion of laminated materials within the temperature range of –55°C to 100°C. Inorganic substrates (non-laminated) ...